Embedded Solution Product of the Year
Company Name: Microchip Technology
Product Name: SAM9X75D5M System-in-Package (SiP)
Supporting Statement:
As automotive and e-mobility applications evolve, designers are integrating increasingly sophisticated Human-Machine Interfaces (HMIs) with advanced graphics to enhance the user experience. This shift is being driven not only by rising user expectations, but also by the growing complexity of in-vehicle systems. Modern HMIs must present information from multiple sources within a single, cohesive interface. As a result, designers are under increasing pressure to deliver higher graphical performance while maintaining reliability, cost efficiency and compliance with automotive standards.
To address the demand for HMI solutions, Microchip released its AEC-Q100 Grade 2-qualified SAM9X75D5M System-in-Package (SiP); it combines an Arm926EJ-S processor with 512 Mbit of DDR2 SDRAM in a single package.
By housing both the processor and memory in one package, the SAM9X75D5M reduces required PCB real estate, simplifies routing complexity, and removes the need to source discrete DRAM components. In addition, this approach offers more predictable supply availability at a time when discrete DDR memory markets are experiencing volatility and procurement constraints.
The product supports large display sizes up to 10 inches and XGA resolution of 1024 × 768 pixels. This makes it ideal for automotive applications such as digital cockpit clusters, smart clusters for two- and three-wheelers, HVAC control and EV chargers. It has been designed to support long-term availability and reliability while balancing cost, performance and power efficiency.
The SAM9X75D5M also offers advanced security functions, including tamper detection, secure boot, secure key storage, TRNG, PUF and higher-performance crypto accelerators for AES and SHA.
The SiP forms part of Microchip’s hybrid MCU family. Products in this family enable users to capitalize on the advanced processing capabilities of a microprocessor (MPU) with access to embedded, higher memory densities while maintaining the familiar development environment of MCU-based designs, and the option to develop using Real-Time Operating Systems (RTOS). In other words, the architecture is intended to give designers access to higher processing power and memory density while retaining development workflows common in MCU-based projects.
Rod Drake, corporate vice president of Microchip Technology’s MPU business unit said: “Microchip’s SAM9X75D5M product redefines the standard for automotive-grade solutions, combining a high-performance processor with memory in a single package and bringing benefits of a SiP to the automotive market. One of the advantages of a SiP is that it provides significantly more RAM buffer space than a traditional MCU implementation and on a much more compact PCB than can be done with discrete memory—giving designers options to fit complex designs into a small space.”
The SAM9X75D5M features a comprehensive range of advanced connectivity options, including CAN FD, USB and Gigabit Ethernet (GbE) with Time-Sensitive Networking (TSN) protocol support. It also comes with integrated 2D graphics and audio capabilities.
The product is supported by Microchip’s MPLAB X Integrated Development Environment (IDE) and MPLAB Harmony Software Framework to enable development for multiple Real-Time Operating Systems (RTOS) including FreeRTOS and Eclipse ThreadX, and bare-metal software. Developers can utilize the Microchip Graphics Suite (MGS) or other third-party graphics software tools such as Crank, LVGL, Altia and Embedded Wizard to develop compelling graphics. Further enhancing the design environment, the SAM9X75 Curiosity LAN Kit (EV31H43A) is available to help engineers evaluate the SAM9X75 SiP devices.
Conclusion
In summary, SAM9X75 hybrid MCU System-in-Package (SiP) delivers:
• Low System Cost and High Value Integration 800MHz ARM926EJ-S Core, 266MHz System/Memory Bus
• Enhanced User Interface capability: 24-bit LCD Controller with overlays up to 1024×768 resolution
• Large number of connectivity options including ingle 10/100/1G Ethernet and One Quad/Octal SPI controller
• Fully Integrated Security that includes Secure Boot with on-chip Secure Key Storage (OTP), Hardware Encryption Engine (TDES, AES and SHA) and FIPs compliant True Random Number Generator (TRNG)
Entry ID: 7474
