Test and Measurement Product of the Year
Company Name: Smiths Interconnect, a Molex company
Product Name: L series with new high-power modules
Supporting Statement:
As test and measurement environments evolve toward higher power density and increasingly complex system architectures, engineers are required to integrate multiple functions—power, signal, and high-speed data—within compact and reliable interfaces. At the same time, test systems must withstand frequent mating cycles, harsh environments, and demanding operational constraints without compromising performance or repeatability.
The L Series High Density Modular Connectors are designed to address these challenges through a highly flexible and robust modular architecture. Their layout enables the combination of signal, power, coaxial, data, and pneumatic modules within a single connector frame, significantly simplifying system integration while reducing the need for multiple interconnect solutions. This modular building-block approach allows engineers to configure connectors tailored to specific applications using off-the-shelf components, reducing both complexity and lead times.
With the addition of new high-power modules equipped with Hypertac Green ConnectTM contact technology supporting currents up to 250 A, the L Series extends its capabilities to meet the needs of modern high-power test systems. This enables the integration of high-current power delivery and high-speed data transmission within a single interface, contributing to more compact, efficient, and scalable test setups.
Built on Hypertac® hyperboloid contact technology, the L Series ensures low contact resistance, minimal heat generation, and excellent resistance to shock and vibration. This results in highly stable electrical performance and reduced risk of intermittent connections—critical factors in maintaining measurement accuracy and minimizing downtime in high-throughput test environments.
Engineered for durability, the connectors support up to 100,000 mating cycles while maintaining low insertion and extraction forces, making them ideal for repetitive testing operations. Features such as float mounting for blind mating, quick-disconnect jackscrews, and multiple frame configurations further enhance usability and reliability in rack-and-panel applications.
Operating across a wide temperature range and supporting widely used communication protocols, the L Series provides a versatile, high-performance interconnect solution that enables more reliable, efficient, and adaptable test system design.
Entry ID: 7542
