Embedded Solution Product of the Year
Company Name: Octavo Systems
Product Name: OSD32MP2x-PM
Supporting Statement:
The OSD32MP2x-PM from Octavo Systems is redefining what embedded designers should expect from a modern processor module. Built around the new STMicroelectronics STM32MP2 platform, this next-generation System-in-Package (SiP) delivers exceptional compute density, AI readiness, and accelerated time-to-market in one of the smallest industrial-ready footprints available today.
At a time when embedded systems are being pushed to deliver more intelligence, more connectivity, and more real-time performance at the edge, the OSD32MP2x-PM offers a breakthrough solution: high-performance heterogeneous processing combined with integrated AI acceleration, all inside an ultra-compact 9mm x 14mm package. This is not simply another processor module; it is technology that will enable the next generation of intelligent embedded products.
The OSD32MP2x-PM deserves to win the 2026 Embedded Solution Product of the Year award because of its ability to remove one of the biggest barriers in advanced embedded design, that being complexity.
High-speed DDR routing is one of the most difficult and risk-prone aspects of processor-based hardware development. By integrating the STM32MP2 processor and DDR4 memory into a single validated SiP, Octavo eliminates this challenge entirely, dramatically reducing PCB complexity, lowering layer counts, shortening development cycles, and minimizing costly design respins. Octavo estimates that its SiP architecture can reduce board-layer requirements by up to 50%, avoiding significant costs and preserving engineering savings.
But simplification alone is not enough to win in today’s market. Performance matters – and the OSD32MP2x-PM delivers.
At its core, the module combines:
• Dual Arm Cortex-A35 processors running up to 1.5GHz for high-level application processing
• An Arm Cortex-M33 real-time core at 400MHz for deterministic control
• A dedicated Neural Processing Unit (NPU) for AI inference acceleration
• Advanced 3D graphics support including OpenGL ES 3.1, Vulkan 1.1, and OpenCL 1.2
This heterogeneous architecture allows designers to consolidate workloads that would traditionally require multiple processors. Industrial control, machine vision, predictive maintenance, robotics, and edge analytics can now be implemented on a single compact platform.
The integrated AI NPU is one of the strongest differentiators and a major reason this product stands out in 2026.
As embedded systems increasingly adopt AI for real-time decision-making, many developers struggle with the trade-offs between performance, power, and implementation complexity. The OSD32MP2x-PM directly addresses this challenge by providing hardware-accelerated AI at the edge. This enables applications such as object recognition, anomaly detection, sensor fusion, and intelligent automation without requiring cloud dependency or excessive power budgets.
In practical terms, this means engineers can now “lean into AI” with confidence, designing smarter systems from day one instead of treating AI as an afterthought.
The breadth of connectivity further strengthens the product’s position. The OSD32MP2x-PM exposes access to the full STM32MP2 peripheral set, including Gigabit Ethernet with TSN, PCIe, USB 3.0, CAN-FD, I3C, multiple SPI and UART channels, audio interfaces, ADCs, and camera inputs. This versatility allows the same core module to be deployed across multiple industries and product families.
Importantly, this flexibility is paired with industrial-grade reliability, with operating temperature options down to -40°C, making it suitable for harsh environments where intelligent edge processing is increasingly required.
Beyond the silicon itself, Octavo’s ecosystem strengthens the value proposition. The company has built its reputation on making advanced integration accessible through strong documentation, development tools, reference designs, and engineering support. Founded on the belief that System-in-Package technology is the next evolution of Moore’s Law, Octavo Systems has consistently delivered products that democratize complex semiconductor integration.
The OSD32MP2x-PM represents the culmination of that vision.
It brings together:
• Innovation: one of the smallest STM32MP2-based AI-capable SiPs on the market
• Technical excellence: high-performance heterogeneous compute with integrated AI acceleration
• Commercial impact: dramatically faster development, reduced engineering risk, and lower BOM/system cost
• Market relevance: perfectly aligned with the explosion of edge AI applications across industrial, medical, automation, and smart infrastructure sectors
This product is launching at exactly the right time with exactly the right capabilities.
The OSD32MP2x-PM deserves to win the Instrumentation & Electronics Award 2026 because it is not just improving embedded design – it is fundamentally changing how engineers approach intelligent edge systems. By removing complexity, accelerating innovation, and enabling practical AI at the edge, Octavo Systems has delivered one of the most important embedded product advancements of the year.
Entry ID: 7582
